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Conductive structural adhesive

9801 Conductive structural adhesive

One component, low viscosity, high thixotropy, easy to glue, conductive structure for bonding

Product details

Model 9801

Use features

One component, low viscosity and high thixotropy, easy to glue for bonding the conductive structure


 Appearance

Silvery

Mixing ratio

 -

Viscosity(Pa.s)  

13000±1500cp

Adhesion

4~6Mpa

Curing condition

15min/100℃30min/80℃


Hardness

Shore D75±5


Volume resistivity(Ω.cm)   

0.00003

Elongation at break%

-

Compression ratio%

-

Brand

Dedicated to providing customers with a full range of electronic industrial adhesives and industrial process solutions

Contact Us

  • 0755-28199192

  • sales@txbond.com

  • 0755-28192800

  • 2410, building 4, Tian'an Yungu, banxuegang Avenue, Longgang District, Shenzhen