Fast curing, high thermal conductivity, no flow of paste, and adhesive with most of the base
Model |
AS1405 |
Colour | Gray | ViscosityGraycp(25℃) | 760000 |
Chemical type | Silica gel | Application features | Fast curing, high thermal conductivity, no flow of paste, and adhesive with most of the base | Hardness | 56A |
Tensile strength |
1.5Mpa |
Thermal conductivity(W/m.k) |
3.89 |
Curing rate (initial solid / whole solid)Tensile strength |
30min/100℃, 15min/150℃ |
Volume resistivity(Ω.cm) | 4.6*1012 |
Dedicated to providing customers with a full range of electronic industrial adhesives and industrial process solutions
0755-28199192
sales@txbond.com
0755-28192800
2410, building 4, Tian'an Yungu, banxuegang Avenue, Longgang District, Shenzhen
Copyright 2002-2018 of Shenzhen TXBOND Technologies Co. Ltd. All Righ粤ICP备17117468号