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Heat conduction bonding

As1405 Heat conduction bonding

Fast curing, high thermal conductivity, no flow of paste, and adhesive with most of the base

Product details

Model

AS1405

Colour Gray ViscosityGraycp(25℃) 760000
Chemical type Silica gel Application features Fast curing, high thermal conductivity, no flow of paste, and adhesive with most of the base Hardness 56A
Tensile strength 1.5Mpa
Thermal conductivity(W/m.k) 3.89
Curing rate (initial solid / whole solid)Tensile strength 30min/100℃,
15min/150℃
Volume resistivity(Ω.cm) 4.6*1012

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