Luxbond 9126 -, low temperature fast curing modified epoxy resin adhesive. In a relatively low temperature and very short time, a good bonding force is formed between various types of material. The product has excellent performance and high storage stability.
| Model |
9126 |
Working temperature℃ |
-50~120 | Viscositycp(25℃） | 20000 |
| Working hours25℃ | 7Day |
Use features |
High viscosity, high temperature resistance, suitable for fixed bonding of transistors and similar semiconductor components, protective enveloping of various integrated circuits |
Curing condition |
15min/80℃ 20min/75℃ |
| Tg/℃ |
52 |
Appearance |
Black |
Dedicated to providing customers with a full range of electronic industrial adhesives and industrial process solutions
0755-28199192
sales@txbond.com
0755-28192800
2410, building 4, Tian'an Yungu, banxuegang Avenue, Longgang District, Shenzhen
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