Luxbond 9126 -, low temperature fast curing modified epoxy resin adhesive. In a relatively low temperature and very short time, a good bonding force is formed between various types of material. The product has excellent performance and high storage stability.
High viscosity, high temperature resistance, suitable for fixed bonding of transistors and similar semiconductor components, protective enveloping of various integrated circuits
Dedicated to providing customers with a full range of electronic industrial adhesives and industrial process solutions
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