Electronic industrial adhesives and industrial process solutions TEL:0755-28199192

Your current positionHome - Porducts - Bonding Series

Modified epoxy resin

9126 Modified epoxy resin

Luxbond 9126 -, low temperature fast curing modified epoxy resin adhesive. In a relatively low temperature and very short time, a good bonding force is formed between various types of material. The product has excellent performance and high storage stability.

Product details



Working temperature℃ 
-50~120 Viscositycp(25℃) 20000
Working hours25℃ 7Day Use features    

High viscosity, high temperature resistance, suitable for fixed bonding of transistors and similar semiconductor components, protective enveloping of various integrated circuits

Curing condition 15min/80℃
Tg/℃ 52

Dedicated to providing customers with a full range of electronic industrial adhesives and industrial process solutions

Contact Us

  • 0755-28199192

  • sales@txbond.com

  • 0755-28192800

  • 2410, building 4, Tian'an Yungu, banxuegang Avenue, Longgang District, Shenzhen