Luxbond 919 is a low halogen type epoxy based liquid filling material for assembly of CSP, BGA and uBGA. This kind of filling material has fast curing at low temperature and similar to the reliability of using thermosetting resin, with excellent maintainability. The cured filling material, if necessary, can be dismantled at any time, the product is easily distributed, and can be quickly passed through, for example, a 15 micron gap. For assembly of CSP, BGA and uBGA. The filling material allows the repair of defective connections to improve the yield of the assembly process. The product is used in easily impacted electronic products, such as portable phones, notebook computers, and so on, to improve the assembly reliability of CSP and BGA.
Low viscosity, low halogen and good permeability, used for the bottom filling of CSP, BGA and UBGA. Improve the reliability of assembly
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