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TCP Thermally Conductive Pad

Tp700 TCP Thermally Conductive Pad

High thermal conductivity and low thermal resistance for heat conduction of high calorific components

Product details

Model TP300
Colour Wathet Breakdown voltage >6KV/mm
Chemical type Silicon sheet Application features应 

High thermal conductivity and low thermal resistance for heat conduction of high calorific components

Hardnessshore 00 35~50
Proportion 3.3 Thickness

1.0~10.0mm

Applied temperature℃  
-40-150℃
Thermal weightlessness(150℃,240h) <1.0% Thermal conductivity(W/m.k) 7.0


Thermal conductivity 0.8~7.0W/m.k optional

Low pressure contraction force application, thickness 0.25~12mm optional

Shore 00 hardness, double-sided self adhesive

High electrical insulation and good temperature resistance

Optional glass fiber reinforcement

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  • 0755-28199192

  • sales@txbond.com

  • 0755-28192800

  • 2410, building 4, Tian'an Yungu, banxuegang Avenue, Longgang District, Shenzhen